A new system for vacuum deposition of refractory materials using an atmospheric-pressure inductively coupled plasma
Merkle, B. D. ; Kniseley, R. N. ; Schmidt, F. A.
[S.l.] : American Institute of Physics (AIP)
Published 1987
[S.l.] : American Institute of Physics (AIP)
Published 1987
ISSN: |
1089-7550
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Source: |
AIP Digital Archive
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Topics: |
Physics
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Notes: |
We have successfully developed a technique utilizing an atmospheric-pressure inductively coupled plasma combined with a low-pressure deposition chamber for deposition of thin films. The equipment and method of operation are discussed. Refractory powders (Nb and Y2O3) were injected into the plasma and deposited as Nb and substoichiometric yttrium oxide, YO1.49, onto Fe and Cu substrates. The substoichiometric yttrium oxide deposit adhered well to the Fe and Cu substrates, while the Nb deposit adhered well to the Fe only. The Nb deposit on the Cu substrate flaked and peeled probably because of stresses induced from the thermal expansion mismatch between the Nb and Cu. Further studies will be undertaken to better understand the processes occurring in this type of plasma-coating system in order to optimize the instrumental parameters for particular coating applications.
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Type of Medium: |
Electronic Resource
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URL: |