New aspects of micromachining and microlithography using 157-nm excimer laser radiation
| ISSN: |
1432-0630
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|---|---|
| Keywords: |
PACS: 42.55.Lt; 42.62.Cf; 42.70.Qs
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| Source: |
Springer Online Journal Archives 1860-2000
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| Topics: |
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Physics
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| Notes: |
Abstract. The use of F2 excimer laser sources, emitting at 157 nm, constitutes a new promising tool for scientific, industrial and lithography applications. The 157-nm laser emission enables high-resolution processes and the high photon energy offers the unique possiblity of photoionizing molecules in a single step. Therefore a lower fragmentation or thermal loading takes place. The 157-nm radiation will enable fundamental research and development for deep UV (DUV) high-resolution optical microlithography in the manufacturing of integrated circuits. This is the next step from the technology of ArF lasers at 193 nm. Furthermore, benefits are expected for key technologies requiring high-resolution processing and the micromachining of tough materials like Teflon or fused silica for micro-optics fabrication. Such applications require F2 excimer laser sources with high performance, reliability and efficiency. The world of nanotechnology is just beginning to reveal its potential.
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| Type of Medium: |
Electronic Resource
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| URL: |
| _version_ | 1798295437609795584 |
|---|---|
| autor | Fiebig, M. Kauf, M. Fair, J. Endert, H. Rahe, M. Basting, D. |
| autorsonst | Fiebig, M. Kauf, M. Fair, J. Endert, H. Rahe, M. Basting, D. |
| book_url | http://dx.doi.org/10.1007/s003390051405 |
| datenlieferant | nat_lic_papers |
| hauptsatz | hsatz_simple |
| identnr | NLM203268075 |
| issn | 1432-0630 |
| journal_name | Applied physics |
| materialart | 1 |
| notes | Abstract. The use of F2 excimer laser sources, emitting at 157 nm, constitutes a new promising tool for scientific, industrial and lithography applications. The 157-nm laser emission enables high-resolution processes and the high photon energy offers the unique possiblity of photoionizing molecules in a single step. Therefore a lower fragmentation or thermal loading takes place. The 157-nm radiation will enable fundamental research and development for deep UV (DUV) high-resolution optical microlithography in the manufacturing of integrated circuits. This is the next step from the technology of ArF lasers at 193 nm. Furthermore, benefits are expected for key technologies requiring high-resolution processing and the micromachining of tough materials like Teflon or fused silica for micro-optics fabrication. Such applications require F2 excimer laser sources with high performance, reliability and efficiency. The world of nanotechnology is just beginning to reveal its potential. |
| package_name | Springer |
| publikationsjahr_anzeige | 1999 |
| publikationsjahr_facette | 1999 |
| publikationsjahr_intervall | 8004:1995-1999 |
| publikationsjahr_sort | 1999 |
| publisher | Springer |
| reference | 69 (1999), S. S305 |
| schlagwort | PACS: 42.55.Lt; 42.62.Cf; 42.70.Qs |
| search_space | articles |
| shingle_author_1 | Fiebig, M. Kauf, M. Fair, J. Endert, H. Rahe, M. Basting, D. |
| shingle_author_2 | Fiebig, M. Kauf, M. Fair, J. Endert, H. Rahe, M. Basting, D. |
| shingle_author_3 | Fiebig, M. Kauf, M. Fair, J. Endert, H. Rahe, M. Basting, D. |
| shingle_author_4 | Fiebig, M. Kauf, M. Fair, J. Endert, H. Rahe, M. Basting, D. |
| shingle_catch_all_1 | Fiebig, M. Kauf, M. Fair, J. Endert, H. Rahe, M. Basting, D. New aspects of micromachining and microlithography using 157-nm excimer laser radiation PACS: 42.55.Lt; 42.62.Cf; 42.70.Qs PACS: 42.55.Lt; 42.62.Cf; 42.70.Qs Abstract. The use of F2 excimer laser sources, emitting at 157 nm, constitutes a new promising tool for scientific, industrial and lithography applications. The 157-nm laser emission enables high-resolution processes and the high photon energy offers the unique possiblity of photoionizing molecules in a single step. Therefore a lower fragmentation or thermal loading takes place. The 157-nm radiation will enable fundamental research and development for deep UV (DUV) high-resolution optical microlithography in the manufacturing of integrated circuits. This is the next step from the technology of ArF lasers at 193 nm. Furthermore, benefits are expected for key technologies requiring high-resolution processing and the micromachining of tough materials like Teflon or fused silica for micro-optics fabrication. Such applications require F2 excimer laser sources with high performance, reliability and efficiency. The world of nanotechnology is just beginning to reveal its potential. 1432-0630 14320630 Springer |
| shingle_catch_all_2 | Fiebig, M. Kauf, M. Fair, J. Endert, H. Rahe, M. Basting, D. New aspects of micromachining and microlithography using 157-nm excimer laser radiation PACS: 42.55.Lt; 42.62.Cf; 42.70.Qs PACS: 42.55.Lt; 42.62.Cf; 42.70.Qs Abstract. The use of F2 excimer laser sources, emitting at 157 nm, constitutes a new promising tool for scientific, industrial and lithography applications. The 157-nm laser emission enables high-resolution processes and the high photon energy offers the unique possiblity of photoionizing molecules in a single step. Therefore a lower fragmentation or thermal loading takes place. The 157-nm radiation will enable fundamental research and development for deep UV (DUV) high-resolution optical microlithography in the manufacturing of integrated circuits. This is the next step from the technology of ArF lasers at 193 nm. Furthermore, benefits are expected for key technologies requiring high-resolution processing and the micromachining of tough materials like Teflon or fused silica for micro-optics fabrication. Such applications require F2 excimer laser sources with high performance, reliability and efficiency. The world of nanotechnology is just beginning to reveal its potential. 1432-0630 14320630 Springer |
| shingle_catch_all_3 | Fiebig, M. Kauf, M. Fair, J. Endert, H. Rahe, M. Basting, D. New aspects of micromachining and microlithography using 157-nm excimer laser radiation PACS: 42.55.Lt; 42.62.Cf; 42.70.Qs PACS: 42.55.Lt; 42.62.Cf; 42.70.Qs Abstract. The use of F2 excimer laser sources, emitting at 157 nm, constitutes a new promising tool for scientific, industrial and lithography applications. The 157-nm laser emission enables high-resolution processes and the high photon energy offers the unique possiblity of photoionizing molecules in a single step. Therefore a lower fragmentation or thermal loading takes place. The 157-nm radiation will enable fundamental research and development for deep UV (DUV) high-resolution optical microlithography in the manufacturing of integrated circuits. This is the next step from the technology of ArF lasers at 193 nm. Furthermore, benefits are expected for key technologies requiring high-resolution processing and the micromachining of tough materials like Teflon or fused silica for micro-optics fabrication. Such applications require F2 excimer laser sources with high performance, reliability and efficiency. The world of nanotechnology is just beginning to reveal its potential. 1432-0630 14320630 Springer |
| shingle_catch_all_4 | Fiebig, M. Kauf, M. Fair, J. Endert, H. Rahe, M. Basting, D. New aspects of micromachining and microlithography using 157-nm excimer laser radiation PACS: 42.55.Lt; 42.62.Cf; 42.70.Qs PACS: 42.55.Lt; 42.62.Cf; 42.70.Qs Abstract. The use of F2 excimer laser sources, emitting at 157 nm, constitutes a new promising tool for scientific, industrial and lithography applications. The 157-nm laser emission enables high-resolution processes and the high photon energy offers the unique possiblity of photoionizing molecules in a single step. Therefore a lower fragmentation or thermal loading takes place. The 157-nm radiation will enable fundamental research and development for deep UV (DUV) high-resolution optical microlithography in the manufacturing of integrated circuits. This is the next step from the technology of ArF lasers at 193 nm. Furthermore, benefits are expected for key technologies requiring high-resolution processing and the micromachining of tough materials like Teflon or fused silica for micro-optics fabrication. Such applications require F2 excimer laser sources with high performance, reliability and efficiency. The world of nanotechnology is just beginning to reveal its potential. 1432-0630 14320630 Springer |
| shingle_title_1 | New aspects of micromachining and microlithography using 157-nm excimer laser radiation |
| shingle_title_2 | New aspects of micromachining and microlithography using 157-nm excimer laser radiation |
| shingle_title_3 | New aspects of micromachining and microlithography using 157-nm excimer laser radiation |
| shingle_title_4 | New aspects of micromachining and microlithography using 157-nm excimer laser radiation |
| sigel_instance_filter | dkfz geomar wilbert ipn albert fhp |
| source_archive | Springer Online Journal Archives 1860-2000 |
| timestamp | 2024-05-06T09:36:11.211Z |
| titel | New aspects of micromachining and microlithography using 157-nm excimer laser radiation |
| titel_suche | New aspects of micromachining and microlithography using 157-nm excimer laser radiation |
| topic | ZL U |
| uid | nat_lic_papers_NLM203268075 |