Electrical characteristics of the rf-excited oxygen plasma-cathodization-grown SiO2/Si interface

Liang, Z. X. ; Han, Z. S. ; Lou, J. S. ; Wang, L. C.
Springer
Published 1996
ISSN:
1432-0630
Keywords:
PACS: 73.20. ; r; 81.40.Rs; 81.60.Cp
Source:
Springer Online Journal Archives 1860-2000
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Physics
Notes:
Abstract.  The electrical properties of the SiO2/n-type Si(100) interface, where the silicon-oxide layer was grown by an electrodeless rf oxygen-plasma-cathodization technique, were investigated using C-V and DLTS methods. Interface traps with high density in the range of 1012 eV-1 cm-2 and a capture cross section as large as 10-18 cm2 were found in the upper region of the silicon forbidden gap. After a post-annealing process, typically at 400 °C for 30 min in dry N2 atmosphere, their densities and capture cross sections were reduced to the range of 1–2×1011 eV-1 cm-2 and 10-19 cm-2, respectively. Apparant differences in DLTS curves before and after thermal annealing were also observed. Results are qualitatively explained by considering the specific oxidation and annealing mechanism of this low-temperature silicon-oxidation technique.
Type of Medium:
Electronic Resource
URL:
_version_ 1798295434897129472
autor Liang, Z. X.
Han, Z. S.
Lou, J. S.
Wang, L. C.
autorsonst Liang, Z. X.
Han, Z. S.
Lou, J. S.
Wang, L. C.
book_url http://dx.doi.org/10.1007/BF01594239
datenlieferant nat_lic_papers
hauptsatz hsatz_simple
identnr NLM203255240
issn 1432-0630
journal_name Applied physics
materialart 1
notes Abstract.  The electrical properties of the SiO2/n-type Si(100) interface, where the silicon-oxide layer was grown by an electrodeless rf oxygen-plasma-cathodization technique, were investigated using C-V and DLTS methods. Interface traps with high density in the range of 1012 eV-1 cm-2 and a capture cross section as large as 10-18 cm2 were found in the upper region of the silicon forbidden gap. After a post-annealing process, typically at 400 °C for 30 min in dry N2 atmosphere, their densities and capture cross sections were reduced to the range of 1–2×1011 eV-1 cm-2 and 10-19 cm-2, respectively. Apparant differences in DLTS curves before and after thermal annealing were also observed. Results are qualitatively explained by considering the specific oxidation and annealing mechanism of this low-temperature silicon-oxidation technique.
package_name Springer
publikationsjahr_anzeige 1996
publikationsjahr_facette 1996
publikationsjahr_intervall 8004:1995-1999
publikationsjahr_sort 1996
publisher Springer
reference 62 (1996), S. 391-395
schlagwort PACS: 73.20.
r; 81.40.Rs; 81.60.Cp
search_space articles
shingle_author_1 Liang, Z. X.
Han, Z. S.
Lou, J. S.
Wang, L. C.
shingle_author_2 Liang, Z. X.
Han, Z. S.
Lou, J. S.
Wang, L. C.
shingle_author_3 Liang, Z. X.
Han, Z. S.
Lou, J. S.
Wang, L. C.
shingle_author_4 Liang, Z. X.
Han, Z. S.
Lou, J. S.
Wang, L. C.
shingle_catch_all_1 Liang, Z. X.
Han, Z. S.
Lou, J. S.
Wang, L. C.
Electrical characteristics of the rf-excited oxygen plasma-cathodization-grown SiO2/Si interface
PACS: 73.20.
r; 81.40.Rs; 81.60.Cp
PACS: 73.20.
r; 81.40.Rs; 81.60.Cp
Abstract.  The electrical properties of the SiO2/n-type Si(100) interface, where the silicon-oxide layer was grown by an electrodeless rf oxygen-plasma-cathodization technique, were investigated using C-V and DLTS methods. Interface traps with high density in the range of 1012 eV-1 cm-2 and a capture cross section as large as 10-18 cm2 were found in the upper region of the silicon forbidden gap. After a post-annealing process, typically at 400 °C for 30 min in dry N2 atmosphere, their densities and capture cross sections were reduced to the range of 1–2×1011 eV-1 cm-2 and 10-19 cm-2, respectively. Apparant differences in DLTS curves before and after thermal annealing were also observed. Results are qualitatively explained by considering the specific oxidation and annealing mechanism of this low-temperature silicon-oxidation technique.
1432-0630
14320630
Springer
shingle_catch_all_2 Liang, Z. X.
Han, Z. S.
Lou, J. S.
Wang, L. C.
Electrical characteristics of the rf-excited oxygen plasma-cathodization-grown SiO2/Si interface
PACS: 73.20.
r; 81.40.Rs; 81.60.Cp
PACS: 73.20.
r; 81.40.Rs; 81.60.Cp
Abstract.  The electrical properties of the SiO2/n-type Si(100) interface, where the silicon-oxide layer was grown by an electrodeless rf oxygen-plasma-cathodization technique, were investigated using C-V and DLTS methods. Interface traps with high density in the range of 1012 eV-1 cm-2 and a capture cross section as large as 10-18 cm2 were found in the upper region of the silicon forbidden gap. After a post-annealing process, typically at 400 °C for 30 min in dry N2 atmosphere, their densities and capture cross sections were reduced to the range of 1–2×1011 eV-1 cm-2 and 10-19 cm-2, respectively. Apparant differences in DLTS curves before and after thermal annealing were also observed. Results are qualitatively explained by considering the specific oxidation and annealing mechanism of this low-temperature silicon-oxidation technique.
1432-0630
14320630
Springer
shingle_catch_all_3 Liang, Z. X.
Han, Z. S.
Lou, J. S.
Wang, L. C.
Electrical characteristics of the rf-excited oxygen plasma-cathodization-grown SiO2/Si interface
PACS: 73.20.
r; 81.40.Rs; 81.60.Cp
PACS: 73.20.
r; 81.40.Rs; 81.60.Cp
Abstract.  The electrical properties of the SiO2/n-type Si(100) interface, where the silicon-oxide layer was grown by an electrodeless rf oxygen-plasma-cathodization technique, were investigated using C-V and DLTS methods. Interface traps with high density in the range of 1012 eV-1 cm-2 and a capture cross section as large as 10-18 cm2 were found in the upper region of the silicon forbidden gap. After a post-annealing process, typically at 400 °C for 30 min in dry N2 atmosphere, their densities and capture cross sections were reduced to the range of 1–2×1011 eV-1 cm-2 and 10-19 cm-2, respectively. Apparant differences in DLTS curves before and after thermal annealing were also observed. Results are qualitatively explained by considering the specific oxidation and annealing mechanism of this low-temperature silicon-oxidation technique.
1432-0630
14320630
Springer
shingle_catch_all_4 Liang, Z. X.
Han, Z. S.
Lou, J. S.
Wang, L. C.
Electrical characteristics of the rf-excited oxygen plasma-cathodization-grown SiO2/Si interface
PACS: 73.20.
r; 81.40.Rs; 81.60.Cp
PACS: 73.20.
r; 81.40.Rs; 81.60.Cp
Abstract.  The electrical properties of the SiO2/n-type Si(100) interface, where the silicon-oxide layer was grown by an electrodeless rf oxygen-plasma-cathodization technique, were investigated using C-V and DLTS methods. Interface traps with high density in the range of 1012 eV-1 cm-2 and a capture cross section as large as 10-18 cm2 were found in the upper region of the silicon forbidden gap. After a post-annealing process, typically at 400 °C for 30 min in dry N2 atmosphere, their densities and capture cross sections were reduced to the range of 1–2×1011 eV-1 cm-2 and 10-19 cm-2, respectively. Apparant differences in DLTS curves before and after thermal annealing were also observed. Results are qualitatively explained by considering the specific oxidation and annealing mechanism of this low-temperature silicon-oxidation technique.
1432-0630
14320630
Springer
shingle_title_1 Electrical characteristics of the rf-excited oxygen plasma-cathodization-grown SiO2/Si interface
shingle_title_2 Electrical characteristics of the rf-excited oxygen plasma-cathodization-grown SiO2/Si interface
shingle_title_3 Electrical characteristics of the rf-excited oxygen plasma-cathodization-grown SiO2/Si interface
shingle_title_4 Electrical characteristics of the rf-excited oxygen plasma-cathodization-grown SiO2/Si interface
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source_archive Springer Online Journal Archives 1860-2000
timestamp 2024-05-06T09:36:09.391Z
titel Electrical characteristics of the rf-excited oxygen plasma-cathodization-grown SiO2/Si interface
titel_suche Electrical characteristics of the rf-excited oxygen plasma-cathodization-grown SiO2/Si interface
topic ZL
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