Ion and chemical radical effects on the step coverage of plasma enhanced chemical vapor deposition tetraethylorthosilicate films
Chang, C.-P. ; Pai, C. S. ; Hsieh, J. J.
[S.l.] : American Institute of Physics (AIP)
Published 1990
[S.l.] : American Institute of Physics (AIP)
Published 1990
| ISSN: |
1089-7550
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|---|---|
| Source: |
AIP Digital Archive
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| Topics: |
Physics
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| Notes: |
We have compared the step coverage of plasma enhanced chemical vapor deposition tetraethylorthosilicate films of microwave downstream, high frequency radio frequency (rf), and low frequency rf depositions. The microwave-downstream deposition, characterized by bimolecular surface reactions, produces a conformal step coverage. The rf depositions with ion-induced surface reactions produce a low sidewall, high bottom coverage. The chemical radical and the ion effects on the step coverage are discussed.
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| Type of Medium: |
Electronic Resource
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| URL: |