Thermal stability and interface bowing of submicron TiSi"2/polycrystalline silicon

Norstrom, H. ; Maex, K. ; Vandenabeele, P.

Amsterdam : Elsevier

ISSN:	0040-6090
Source:	Elsevier Journal Backfiles on ScienceDirect 1907 - 2002
Topics:	Physics
Type of Medium:	Electronic Resource
URL:	http://linkinghub.elsevier.com/retrieve/pii/0040-6090(91)90324-Q