Numerical simulation of non-isothermal SMC (sheet molding compound) molding

Twu, J.-T. ; Hill, R. R. ; Wang, T. J. ; Lee, L. James

Brookfield, Conn. : Wiley-Blackwell
Published 1993
ISSN:
0272-8397
Keywords:
Chemistry ; Chemical Engineering
Source:
Wiley InterScience Backfile Collection 1832-2000
Topics:
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
Notes:
Design of molding tools and molding cycles for sheet molding compounds (SMC) is often expensive and time consuming. Computer simulation of the compression molding process is a desirable approach for reducing actual experimental runs. The focus of this work is to develop a computer model that can simulate the most important features of SMC compression molding, including material flow, heat transfer, and curing. A control volume/finite element approach was used to obtain the pressure and velocity fields and to compute the flow progression during compression mold filling. The energy equation and a kinetic model were solved simultaneously for the temperature and conversion profiles differential scanning calorimetry (DSC) was used to experimentally measure the polymer zation kinetics. A rheometrics dynamic analyzer (RDA) was used to measure the rheological changes of the compound. A series of molding experiments was conducted to record the flow front location and material temperature. The results were compared to simulated flow front and temperature profiles.
Additional Material:
7 Ill.
Type of Medium:
Electronic Resource
URL: