Numerical simulation of non-isothermal SMC (sheet molding compound) molding
Twu, J.-T. ; Hill, R. R. ; Wang, T. J. ; Lee, L. James
Brookfield, Conn. : Wiley-Blackwell
Published 1993
Brookfield, Conn. : Wiley-Blackwell
Published 1993
ISSN: |
0272-8397
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Keywords: |
Chemistry ; Chemical Engineering
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Source: |
Wiley InterScience Backfile Collection 1832-2000
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Topics: |
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
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Notes: |
Design of molding tools and molding cycles for sheet molding compounds (SMC) is often expensive and time consuming. Computer simulation of the compression molding process is a desirable approach for reducing actual experimental runs. The focus of this work is to develop a computer model that can simulate the most important features of SMC compression molding, including material flow, heat transfer, and curing. A control volume/finite element approach was used to obtain the pressure and velocity fields and to compute the flow progression during compression mold filling. The energy equation and a kinetic model were solved simultaneously for the temperature and conversion profiles differential scanning calorimetry (DSC) was used to experimentally measure the polymer zation kinetics. A rheometrics dynamic analyzer (RDA) was used to measure the rheological changes of the compound. A series of molding experiments was conducted to record the flow front location and material temperature. The results were compared to simulated flow front and temperature profiles.
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Additional Material: |
7 Ill.
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Type of Medium: |
Electronic Resource
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URL: |