Preparation of superhydrophobic copper surface by a novel silk-screen printing aided electrochemical machining method
| Publication Date: |
2018-04-07
|
|---|---|
| Publisher: |
Institute of Physics (IOP)
|
| Print ISSN: |
1757-8981
|
| Electronic ISSN: |
1757-899X
|
| Topics: |
Mechanical Engineering, Materials Science, Production Engineering, Mining and Metallurgy, Traffic Engineering, Precision Mechanics
|
| Published by: |
| _version_ | 1836398882391588864 |
|---|---|
| autor | X Y Yan, G X Chen and J W Liu |
| beschreibung | A kind of superhydrophobic copper surface with micro-nanocomposite structure has been successfully fabricated by employing a silk-screen printing aided electrochemical machining method. At first silk-screen printing technology has been used to form a column point array mask, and then the microcolumn array would be fabricated by electrochemical machining (ECM) effect. In this study, the drop contact angles have been studied and scanning electron microscopy (SEM) has been used to study the surface characteristic of the workpiece. The experiment results show that the micro-nanocomposite structure with cylindrical array can be successfully fabricated on the metal surface. And the maximum contact angle is 151° when the fluoroalkylsilane ethanol solution was used to modify the machined surface in this study. |
| citation_standardnr | 6228615 |
| datenlieferant | ipn_articles |
| feed_id | 123476 |
| feed_publisher | Institute of Physics (IOP) |
| feed_publisher_url | http://www.iop.org/ |
| insertion_date | 2018-04-07 |
| journaleissn | 1757-899X |
| journalissn | 1757-8981 |
| publikationsjahr_anzeige | 2018 |
| publikationsjahr_facette | 2018 |
| publikationsjahr_intervall | 7984:2015-2019 |
| publikationsjahr_sort | 2018 |
| publisher | Institute of Physics (IOP) |
| quelle | IOP Conference Series: Materials Science and Engineering |
| relation | http://iopscience.iop.org/1757-899X/324/1/012039 |
| search_space | articles |
| shingle_author_1 | X Y Yan, G X Chen and J W Liu |
| shingle_author_2 | X Y Yan, G X Chen and J W Liu |
| shingle_author_3 | X Y Yan, G X Chen and J W Liu |
| shingle_author_4 | X Y Yan, G X Chen and J W Liu |
| shingle_catch_all_1 | Preparation of superhydrophobic copper surface by a novel silk-screen printing aided electrochemical machining method A kind of superhydrophobic copper surface with micro-nanocomposite structure has been successfully fabricated by employing a silk-screen printing aided electrochemical machining method. At first silk-screen printing technology has been used to form a column point array mask, and then the microcolumn array would be fabricated by electrochemical machining (ECM) effect. In this study, the drop contact angles have been studied and scanning electron microscopy (SEM) has been used to study the surface characteristic of the workpiece. The experiment results show that the micro-nanocomposite structure with cylindrical array can be successfully fabricated on the metal surface. And the maximum contact angle is 151° when the fluoroalkylsilane ethanol solution was used to modify the machined surface in this study. X Y Yan, G X Chen and J W Liu Institute of Physics (IOP) 1757-8981 17578981 1757-899X 1757899X |
| shingle_catch_all_2 | Preparation of superhydrophobic copper surface by a novel silk-screen printing aided electrochemical machining method A kind of superhydrophobic copper surface with micro-nanocomposite structure has been successfully fabricated by employing a silk-screen printing aided electrochemical machining method. At first silk-screen printing technology has been used to form a column point array mask, and then the microcolumn array would be fabricated by electrochemical machining (ECM) effect. In this study, the drop contact angles have been studied and scanning electron microscopy (SEM) has been used to study the surface characteristic of the workpiece. The experiment results show that the micro-nanocomposite structure with cylindrical array can be successfully fabricated on the metal surface. And the maximum contact angle is 151° when the fluoroalkylsilane ethanol solution was used to modify the machined surface in this study. X Y Yan, G X Chen and J W Liu Institute of Physics (IOP) 1757-8981 17578981 1757-899X 1757899X |
| shingle_catch_all_3 | Preparation of superhydrophobic copper surface by a novel silk-screen printing aided electrochemical machining method A kind of superhydrophobic copper surface with micro-nanocomposite structure has been successfully fabricated by employing a silk-screen printing aided electrochemical machining method. At first silk-screen printing technology has been used to form a column point array mask, and then the microcolumn array would be fabricated by electrochemical machining (ECM) effect. In this study, the drop contact angles have been studied and scanning electron microscopy (SEM) has been used to study the surface characteristic of the workpiece. The experiment results show that the micro-nanocomposite structure with cylindrical array can be successfully fabricated on the metal surface. And the maximum contact angle is 151° when the fluoroalkylsilane ethanol solution was used to modify the machined surface in this study. X Y Yan, G X Chen and J W Liu Institute of Physics (IOP) 1757-8981 17578981 1757-899X 1757899X |
| shingle_catch_all_4 | Preparation of superhydrophobic copper surface by a novel silk-screen printing aided electrochemical machining method A kind of superhydrophobic copper surface with micro-nanocomposite structure has been successfully fabricated by employing a silk-screen printing aided electrochemical machining method. At first silk-screen printing technology has been used to form a column point array mask, and then the microcolumn array would be fabricated by electrochemical machining (ECM) effect. In this study, the drop contact angles have been studied and scanning electron microscopy (SEM) has been used to study the surface characteristic of the workpiece. The experiment results show that the micro-nanocomposite structure with cylindrical array can be successfully fabricated on the metal surface. And the maximum contact angle is 151° when the fluoroalkylsilane ethanol solution was used to modify the machined surface in this study. X Y Yan, G X Chen and J W Liu Institute of Physics (IOP) 1757-8981 17578981 1757-899X 1757899X |
| shingle_title_1 | Preparation of superhydrophobic copper surface by a novel silk-screen printing aided electrochemical machining method |
| shingle_title_2 | Preparation of superhydrophobic copper surface by a novel silk-screen printing aided electrochemical machining method |
| shingle_title_3 | Preparation of superhydrophobic copper surface by a novel silk-screen printing aided electrochemical machining method |
| shingle_title_4 | Preparation of superhydrophobic copper surface by a novel silk-screen printing aided electrochemical machining method |
| timestamp | 2025-06-30T23:34:08.050Z |
| titel | Preparation of superhydrophobic copper surface by a novel silk-screen printing aided electrochemical machining method |
| titel_suche | Preparation of superhydrophobic copper surface by a novel silk-screen printing aided electrochemical machining method |
| topic | ZL |
| uid | ipn_articles_6228615 |