In-situ observations of classical grain growth mechanisms during sintering of copper nanoparticles on (001) copper

Yeadon, M. ; Yang, J. C. ; Averback, R. S. ; Bullard, J. W. ; Olynick, D. L. ; Gibson, J. M.

Woodbury, NY : American Institute of Physics (AIP)
Published 1997
ISSN:
1077-3118
Source:
AIP Digital Archive
Topics:
Physics
Notes:
The sintering of randomly oriented copper nanoparticles in the size range 4–20 nm with a single crystal (001) copper substrate has been studied in real time using a novel in situ ultrahigh vacuum (UHV) transmission electron microscope. The particles were generated in situ using an UHV DC sputtering attachment and deposited directly onto an electron transparent copper foil inside the microscope. We demonstrate that these particles reorient upon heating to assume the same orientation as the substrate by a classical mechanism involving neck growth and grain boundary motion. © 1997 American Institute of Physics.
Type of Medium:
Electronic Resource
URL: